主要
成果和奖惩情况
| [1]. Fuliang Le, S. W. Ricky Lee, Chaoran Yang, and Jeffery C. C. Lo,“Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing,”IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, Issue 8, (2015), pp. 1178-1185.
[2]. Fuliang Le, S. W. Ricky Lee, Jeffery C. C. Lo, and Chaoran Yang,“Failure Analysis and Experimental Verification for Through-Silicon-Via Underfill Dispensing on 3D Chip Stack Package,”IEEE Transactions on Components, Packaging and Manufacturing Technology, (2015), DOI: 10.1109/TCPMT.2015.2477075.
[3]. Fuliang Le, S. W. Ricky Lee, Kei May Lau, C. Patrick Yue, Johnny K. O. Sin, Philip K. T. Mok, Wing-Hung Ki, and Hoi Wai Choi,“Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking,”Electronic Components and Technology Conference, Orlando, FL, May 2014, pp. 919-924.
[4]. Fuliang Le, S. W. Ricky Lee, Jingshen Wu, and Matthew M. F. Yuen, "Underfill Dispensing for 3D Die Stacking with Through Silicon Vias." International Symposium on Microelectronics, San Diego, CA, September, pp. 548-553.
[5]. Fuliang Le, Jeffery C. C. Lo, Xing Qiu, S. W. Ricky Lee, Xing Li, Chi-Ying Tsui, and Wing-Hung Ki,“Fluxless Packaging of an Implantable Microsystem for Transcorneal Electrical Stimulation (TcES) of Adult Rats,”in Electronics Packaging Technology Conference (EPTC), Marina Mandarin, Singapore, December 2015, (accpeted).
[6]. Fuliang Le, Xinyu Wu, Shiqi Yu, Bin Zhang and Yangsheng Xu, "A Humanoid Mini-Walking Robot with a Stick," in International Conference on Information and Automation, Macau, China, June 2009, pp. 72-77.
[7]. Fuliang Le, Jiawei Luo, Gongping Wu, "An Uninterrupted Bird Repeller on Transmission Line," in International Conference on Robotics and Biomimetics, Guilin, December 2009, pp. 1983-1989.
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